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Products: Process Equipment
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NanoTorr High Vacuum Sputtering Deposition System The NanoTorr Series is a high vacuum magnetron sputtering system that allows multiple materials to be sputtered on several substrates at one passing. The NanoTorr Series is a highly customizable, flexible and efficient tool for thin film coating applications. Standard system is equipped with 8 sputtering cathodes. |
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SpinIE Ion Beam Etching System The SpinIE is equipped with a Veeco ion beam source and controller, and a sophisticated water-cooled substrate holder. It provides precise surface treatment and etching depth uniformity across the whole substrate. It is capable of many types of processing from a simple etch to multiple angle and/or beam energy etches. |
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NanoTorr-EVAP Thermal Evaporation System with Sputtering The NanoTorr-EVAP is a high vacuum thermal evaporation system with sputtering. It allows sequential evaporation and co-evaporation of materials without breaking vacuum. DC/RF/Reactive sputtering of materials/dielectrics, plasma cleaning, and high temperature substrate heating and rotation can be done in the same chamber. |
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SpinEtcher Plasma Ashing System The SpinEtcher is a plasma processing system capable of photoresist ashing using oxygen plasma. The system can accommodate up to 8-inch substrates. The system is designed to provide a wide range of plasma operating conditions. It is ideally suited for research, process development or low volume production. |
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SpinTherm High Vacuum Magnetic Thermal Annealing System The SpinTherm can enhance the performance of spintronics devices, magnetic materials and components. It's fully automated with unlimited user defined recipes. Samples can be thermally treated in temperatures up to 700 C in a uniform magnetic field up to 0.4 Tesla, all in high vacuum environment or inside a special gas with a selected pressure. |
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SpinTron High Vacuum Magnetron Sputter Sources The SpinTron is a circular magnetron sputtering gun that can have a 1, 2, 3, 4 or 6-inch diameter. It can accommodate a wide range of sputtering targets, metallic or insulating, magnetic or non-magnetic. The internal magnetic configuration utilizing a circular rare-earth NdFeB permanent magnet enables excellent film uniformity and target utilization. |
